4. Static information storage and retrieval
  5. Format or disposition of elements

Kwon Whan Han

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High-performance semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multi-layer stacked wafer level semiconductor package module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor chip with chip selection structure and stacked...

Static information storage and retrieval – Format or disposition of elements
Reexamination Certificate

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Stack package having pattern die redistribution

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Wafer level chip scale package (WLCSP) with high reliability...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2211753

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