Semiconductor chip with chip selection structure and stacked...

Details Semiconductor chip with chip selection structure and stacked... Semiconductor chip with chip selection structure and stacked...

2011-03-01

2011-03-01

Hoang, Huan (Department: 2827)

Static information storage and retrieval

Format or disposition of elements

C365S052000, C257S687000

Reexamination Certificate

active

07898834

ABSTRACT:
A semiconductor chip with a chip selection structure suitable for a stacked semiconductor chip includes a semiconductor chip body and a chip selection structure. The chip selection structure includes a chip selection pad disposed over the semiconductor chip body, a main through electrode electrically connected to the chip selection pad, and a sub through electrode interposed between the main through electrode and the chip selection pad. A plurality of the semiconductor chips, each having the same chip selection structure, can be stacked by offsetting the stacked semiconductor chips.

REFERENCES:
patent: 6392292 (2002-05-01), Morishita
patent: 2003/0006490 (2003-01-01), Kawaishi
patent: 2005/0162950 (2005-07-01), Koide
patent: 2009/0121336 (2009-05-01), Kim
patent: 2005-285997 (2005-10-01), None
patent: 2007-012848 (2007-01-01), None

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