Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Flat multiple-chip module micro ball grid array packaging
Glueless integrated circuit system in a packaging module
Hybrid ASIC/memory module package
Miniaturized image sensor
Stacked multiple-chip module micro ball grid array packaging
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Profile ID: LFUS-PAI-P-585390