4. Electricity: conductors and insulators
  5. Feedthrough or bushing
  6. Compression

Kiyoshi Muratake

Inventor

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Integrated circuit device having package with bypass capacitor

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Multi-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Multi-chip semiconductor device and method of producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Semiconductor device

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Semiconductor device having radiator

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Profile ID: LFUS-PAI-P-1225330

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