Semiconductor device

Details Semiconductor device Semiconductor device

1987-01-14

1988-02-09

Wise, Robert E.

357 80, 357 84, H01L 2302, H01L 2312

Patent

active

047244720

ABSTRACT:
A semiconductor device to be mounted on a circuit board, including a semiconductor chip, a package for mounting the semiconductor chip, a plurality of conductor pads provided on the outer surface of the package, and a plurality of conductor pins, connected to the conductor pads in a substantially vertical contact condition, for connecting to the circuit board in accordance with a contacting condition.

REFERENCES:
patent: 3561107 (1971-02-01), Best et al.
patent: 4338621 (1982-07-01), Braun
Patent Abstracts of Japan, vol. 7, No. 27, Feb. 1983.
IBM Technical Disclosure Bulletin, vol. 18, No. 5, Oct. 1975, "Flexible Solder Connection and Method of Fabricating", by P. Geldermans, pp. 1379-1380.

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