Multi-chip semiconductor device and method of producing the same

Details Multi-chip semiconductor device and method of producing the same Multi-chip semiconductor device and method of producing the same

1999-01-11

2000-11-07

Chaudhari, Chandra

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438125, 257720, 257705, 257706, H01L 2144, H01L 2148, H01L 2150, H01L 2334, H01L 2315

Patent

active

061435902

ABSTRACT:
A method of making a semiconductor device including: a ceramic base board formed of AlN; a CPU chip and a CMU chip which are flip-chip bonded on a circuit board which includes the ceramic base board; SRAM chips which are die-bonded to the lower major surface of the circuit board; first heat conductive blocks adhesively attached to the CPU chip and the CMU chip; second heat conductive blocks adhesively attached to the upper major surface of the AlN ceramic base board; a resin package; and a heat sink which, adhesively attached on the upper major surface of the resin package, is in close contact with the first heat conductive blocks and the second heat conductive blocks. The heat generated by the CPU chip and the CMU chip is transferred to the heat sink via the first heat conductive blocks and is radiated from the heat sink.

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