Integrated circuit device having package with bypass capacitor

Details Integrated circuit device having package with bypass capacitor Integrated circuit device having package with bypass capacitor

1983-09-07

1986-07-01

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 80, 174 52FP, H01L 2316, H01L 2348

Patent

active

045983070

ABSTRACT:
In order to protect ICs from noise it is necessary to mount a bypass capacitor as close as possible to the IC die or chip. The package must seal the die from the environment, but there are marginal spaces at the ends of a dual in line type package (DIP type package) which are not needed for the sealing function. An opening is made in the lid of the package at such a marginal area, and a chip capacitor is mounted in the opening. An additional post is provided on the lead frame. A portion of this additional post and a portion of another lead provided by the frame are exposed through the opening in the lid. The chip capacitor is soldered to the exposed portions to mechanically and electrically connect the capacitor. The additional post is scored at the edge of the package to permit easy removal of the portion thereof that would otherwise extend outside the package.

REFERENCES:
patent: 4137546 (1979-01-01), Frusco
patent: 4249196 (1981-02-01), Durney et al.
patent: 4303934 (1981-12-01), Stitt
patent: 4413404 (1983-11-01), Burns
patent: 4451845 (1984-05-01), Philofsky et al.
patent: 4453176 (1984-06-01), Chance et al.
patent: 4454529 (1984-06-01), Philofsky et al.
patent: 4527185 (1985-07-01), Philofsky et al.
patent: 4539622 (1985-09-01), Akasaki

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