Semiconductor device having radiator

Details Semiconductor device having radiator Semiconductor device having radiator

1986-01-28

1987-08-18

Davie, James W.

357 74, H01L 2302

Patent

active

046880771

ABSTRACT:
A semiconductor device having a semiconductor package and a radiator. The semiconductor package houses a semiconductor chip therein. The radiator includes a pillar which has a plurality of fins thereon. One end of the pillar is bonded to the semiconductor package. A hole is formed in the other end of the pillar and extends the longitudinal direction of the pillar.

REFERENCES:
patent: 2994017 (1961-07-01), Kadelburg
patent: 3457988 (1969-07-01), Meyerhoff et al.
patent: 4292647 (1981-09-01), Lee
patent: 4340902 (1982-07-01), Honda et al.
IBM Technical Disclosure Bulletin, "Heat Conductor Module", Hwaug et al., vol. 21, No. 1, p. 138, (6/1978).
IBM Technical Disclosure Bulletin, vol. 23, No. 9, Feb. 1981, pp. 4222-4223, Nutter et al., "Center Post Heat Sink".

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