4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Kimiharu Kayukawa

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Bump bonding method

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Manufacturing device of semiconductor package and...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Packaging method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Semiconductor device having tin-based solder layer and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Vertical type semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2290532

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