Manufacturing device of semiconductor package and...

Details Manufacturing device of semiconductor package and... Manufacturing device of semiconductor package and...

2007-07-31

2010-02-09

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S014000, C438S011000

Reexamination Certificate

active

07659127

ABSTRACT:
A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiating an infrared light toward the substrate and monitoring an electrode pad under the second metal bump based on a reflected light reflected on the pad; and a determination element for determining a state of a bonding surface between the first and second metal bumps based on monitoring information of the pad. The monitoring element faces the bonding element through the holding element, the substrate and the package.

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