Bump bonding method

Details Bump bonding method Bump bonding method

2011-07-05

2011-07-05

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C029S841000, C228S180220, C228S180500, C438S615000, C438S617000

Reexamination Certificate

active

07971349

ABSTRACT:
In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The first and second members are positioned with respect to each other such that the first and second bumps face each other. The tip portion of the first bump is brought into contact with a tip portion of the second bump by sticking the projection into the tip portion of the second bump.

REFERENCES:
patent: 5633204 (1997-05-01), Tago et al.
patent: 6538335 (2003-03-01), Shimada et al.
patent: A-04-116944 (1992-04-01), None
patent: 6-188289 (1994-07-01), None
patent: A-2000-232129 (2000-08-01), None
patent: A-2003-197672 (2003-07-01), None
patent: A-2008-035918 (2008-02-01), None
Office Action mailed May 11, 2010 issued from the Japan Patent Office in the corresponding patent application No. 2008-079771 (and English translation).

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