Kimball M. Watson

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Edge seal for thru-silicon-via technology

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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In-line depth measurement for thru silicon via

Data processing: measuring – calibrating – or testing – Measurement system – Dimensional determination
Reexamination Certificate

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Metal wiring structure for integration with through...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Method and structure for ballast resistor

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure
Reexamination Certificate

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Method to assess electromigration and hot electron reliability f

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Profile ID: LFUS-PAI-P-1514157

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