4. Electrical computers and digital data processing systems: input/
  5. Input/output data processing
  6. Direct memory accessing

Khanh Q. Tran

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Borderless vias with HSQ gap filled metal patterns having high e

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Borderless vias with HSQ gap filled metal patterns having...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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High density plasma oxide gap filled patterned metal layers with

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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High integrity borderless vias with protective sidewall spacer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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High integrity borderless vias with protective sidewall spacer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-477045

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