4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Kenji Toyosawa

Inventor

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active

Lead frame for use in a semiconductor device and a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Patent

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Semiconductor carrier film, and semiconductor device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Semiconductor device and film carrier tape and respective manufa

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Profile ID: LFUS-PAI-P-1211986

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