Semiconductor device

Details Semiconductor device Semiconductor device

2005-03-15

2005-03-15

Quach, T. N. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S696000, C257S734000

Reexamination Certificate

active

06867490

ABSTRACT:
A semiconductor device of the present invention has two inner inner leads to be bonded with inner-side bump electrodes each placed at a position which is a relatively large distance apart from the edge of a semiconductor chip, between outer-side bump electrodes each placed at a position which is a relatively small distance apart from the edge of the semiconductor chip. At least one of the inner inner leads is bent in accordance with a bonding position with the inner-side bump electrode.

REFERENCES:
patent: 5349238 (1994-09-01), Ohsawa et al.
patent: 5442229 (1995-08-01), Mori et al.
patent: 5825081 (1998-10-01), Hosomi et al.
patent: 6603071 (2003-08-01), Takao
patent: 6744120 (2004-06-01), Yanagisawa
patent: 07-335692 (1995-12-01), None
patent: 2000-269611 (2000-09-01), None

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