Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1997-10-02
2000-01-04
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257782, 257668, H01L 2348, H01L 2352, H01L 2940
Patent
active
060113154
ABSTRACT:
A semiconductor device is arranged so that a semiconductor chip is mounted on a film carrier which is composed of (1) an insulating base material tape having an opening section and (2) a conductive wiring having inner leads electrically connected to the semiconductor chip in the opening. The conductive wiring is provided on a main surface of the insulating base material tape. The film carrier is provided with an organic insulating film, which is different from the conductive wiring, covering the conductive wiring and the inner leads so as to support the inner leads.
REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5659198 (1997-08-01), Okutomo et al.
patent: 5767572 (1998-06-01), Fujitsu
patent: 5814879 (1998-09-01), Ishisaka et al.
Ohsono Mitsuaki
Toyosawa Kenji
Clark Sheila V.
Sharp Kabushiki Kaisha
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