Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-03-20
2007-03-20
Owens, Douglas W. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S777000, C257S676000, C257S711000, C257S717000, C257S779000, C257S780000, C257S668000, C257S678000, C257S689000, C257S782000
Reexamination Certificate
active
10166076
ABSTRACT:
Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and the wiring pattern. The semiconductor device of the present invention includes a semiconductor element and a wiring substrate which is provided with a film substrate and a wiring pattern which is formed on the film substrate, the semiconductor element is connected to the wiring pattern, and the semiconductor element and the wiring substrate are sealed with a resin. A metallic film, made of material having a smaller coefficient of linear thermal expansion than the film substrate, is formed in a region where the wiring pattern is not formed on at least one surface of the film substrate.
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Suzuki Takehiro
Toyosawa Kenji
Im Junghwa
Owens Douglas W.
Sharp Kabushiki Kaisha
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