Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Bump forming method, presoldering treatment method,...
Connecting electrode portion in semiconductor device
Flip chip mounting type semiconductor device
Flip-chip connection type semiconductor integrated circuit devic
Flip-chip semiconductor devices having two encapsulants
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Profile ID: LFUS-PAI-P-469961