Flip-chip connection type semiconductor integrated circuit devic

Details Flip-chip connection type semiconductor integrated circuit devic Flip-chip connection type semiconductor integrated circuit devic

1997-01-16

2000-08-29

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257784, 257758, 257700, 257751, 257762, 257766, 257772, H01L 23528, H01L 2348, H01L 2352, H01L 2940

Patent

active

061113174

ABSTRACT:
A first insulating film is formed on an integrated circuit chip on which an I/O pad is formed. A first opening portion is formed above the I/O pad. A conductive layer and a barrier metal layer which are electrically connected to the I/O pad through the first opening portion are stacked on the first insulating film. The conductive layer and the barrier metal layer are patterned by a single mask. A second insulating film is formed on the resultant structure. A second opening portion is formed in the second insulating film at a position different from that of the first opening portion. A solder bump or metal pad is formed on the barrier metal layer in the second opening portion. The position of the solder bump or metal pad is defined by the second opening portion.

REFERENCES:
patent: 5046161 (1991-09-01), Takada
patent: 5272111 (1993-12-01), Kosaki
patent: 5394013 (1995-02-01), Oku et al.
patent: 5448114 (1995-09-01), Kondoh et al.
patent: 5604379 (1997-02-01), Mori
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5656858 (1997-08-01), Kondo et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5719448 (1998-02-01), Ichikawa
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 5773888 (1998-06-01), Hosomi et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5844304 (1998-12-01), Kata et al.
patent: 5883435 (1999-03-01), Geffken et al.
patent: 5886415 (1999-03-01), Akagawa
patent: 5903058 (1999-05-01), Akram

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