4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Katsuya Kosaki

Inventor

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Apparatus and method of electroplating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Agitating or moving electrolyte during coating
Patent

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Apparatus for adhering wafer to supporting substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Patent

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Apparatus for electroplating a semiconductor substrate

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Patent

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Chemical processing method, and method of manufacturing...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Chemical processor

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction
Reexamination Certificate

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Profile ID: LFUS-PAI-P-65922

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