Apparatus for electroplating a semiconductor substrate

Details Apparatus for electroplating a semiconductor substrate Apparatus for electroplating a semiconductor substrate

1997-07-09

1998-12-29

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly semiconductor substrate

204277, 118620, C25D 712, C25B 900, B05B 5025

Patent

active

058535594

ABSTRACT:
An electroplating apparatus includes an electroplating tank having a generally flat base on which a semiconductor substrate may be placed with a surface to be electroplated oriented upwardly. A first seal seals a tank body to the flat base and a second seal seals the tank body to a peripheral portion of the surface of the semiconductor substrate. A substantially sealed volume adjacent the surface of the semiconductor substrate is produced. A gas supply tube for pressurizing the volume and an electrolyte discharge arrangement for discharging electrolyte from the volume when pressurized by a gas introduced through the gas supply tube are also provided. The discharge tube extends through a wall of the tank body to a position immediately above the surface of the semiconductor substrate within the volume.

REFERENCES:
patent: 5084149 (1992-01-01), Kaczur et al.
patent: 5256274 (1993-10-01), Poris

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