Apparatus for adhering wafer to supporting substrate

Details Apparatus for adhering wafer to supporting substrate Apparatus for adhering wafer to supporting substrate

1996-11-26

1998-09-01

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

1565831, 1565833, B30B 1500

Patent

active

058006672

ABSTRACT:
An apparatus for adhering a wafer to a supporting substrate includes a chamber having a lower part including a wafer stage having a planar surface on which a wafer having a surface covered with an adhesive is mounted with the adhesive facing upward, an upper part for covering the planar surface of the wafer stage, an evacuation port for evacuating the chamber, and a pressure plate opposite a supporting substrate disposed on the wafer and movable downward so that the pressure plate presses the supporting substrate toward the wafer. At least three gauge blocks having a thickness larger than that of the wafer are disposed on the planar surface of the wafer stage, surrounding a wafer and sandwiched between the supporting substrate and the planar surface when the supporting substrate is pressed toward the wafer. Heaters for heating the wafer and the supporting substrate are embedded in the lower and upper parts of the chamber. A gap between the wafer and the supporting substrate and filled with the adhesive is uniform within the area of the wafer surface.

REFERENCES:
patent: 4953287 (1990-09-01), West et al.
patent: 5161697 (1992-11-01), Quick
patent: 5297480 (1994-03-01), Miyashita et al.
patent: 5545283 (1996-08-01), Collins et al.
patent: 5578159 (1996-11-01), Miyashita et al.

Affiliated with

Also associated with

Rating

Apparatus for adhering wafer to supporting substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for adhering wafer to supporting substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for adhering wafer to supporting substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-266239