4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Kanto Sanyo Semiconductors Co., Ltd.

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Chucking method and processing method using the same

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field
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Circuit device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Circuit device and method of manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Circuit device and method of manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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