Chucking method and processing method using the same

Details Chucking method and processing method using the same Chucking method and processing method using the same

2005-11-28

2009-02-24

Jackson, Stephen W (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

C361S231000, C361S232000, C361S233000

Reexamination Certificate

active

07495881

ABSTRACT:
The invention provides an electrostatically chucking technology capable of chucking a workpiece formed of an insulator or a workpiece attached with an object to be processed such as a semiconductor wafer on a stage. A layered body attached with a glass substrate for supporting a semiconductor substrate having an electronic device on its surface is prepared, and a conductive film is attached thereto. Then, the layered body is set on a surface of a stage set in a vacuum chamber such as a dry-etching apparatus. After then, a voltage is applied to an internal electrode to generate positive and negative electric charges on the surfaces of the conductive film and the stage, and the layered body is chucked with static electricity generated therebetween. Then, the layered body chucked on the stage is processed by etching, CVD, or PVD.

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European Search Report mailed Nov. 19, 2007, directed to counterpart EP application No. 05026071.

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