4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Kai Chong Chan

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Fabricating method for crack stop structure enhancement of...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Integrated circuit packaging system and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Panel and semiconductor component having a composite board...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Semiconductor package and method for producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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Semiconductor package and method for producing the same

Semiconductor device manufacturing: process – Semiconductor substrate dicing
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Profile ID: LFUS-PAI-P-2192574

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