Integrated circuit packaging system and method of...

Details Integrated circuit packaging system and method of... Integrated circuit packaging system and method of...

2011-02-22

2011-02-22

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S700000, C257SE23010, C257SE23021, C257SE23019, C257SE23020, C257SE23022, C257SE25010, C257SE25011, C257SE25012, C257SE25013

Reexamination Certificate

active

07892963

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit substrate having a non-active side and an active side; forming a recess in the integrated circuit substrate from the non-active side exposing a first contact and a second contact with the first contact and the second contact along the active side; forming a first via, having a first via extension extended beyond the non-active side and an opening at the non-active side, within the recess; forming a barrier liner within the opening with the barrier liner exposed beyond the non-active side; and forming a second via over the barrier liner and within the opening of the first via with the second via exposed beyond the non-active side.

REFERENCES:
patent: 6352923 (2002-03-01), Hsuan et al.
patent: 6800930 (2004-10-01), Jackson et al.
patent: 6908856 (2005-06-01), Beyne et al.
patent: 7410884 (2008-08-01), Ramanathan et al.
patent: 2006/0001174 (2006-01-01), Matsui
patent: 2007/0222050 (2007-09-01), Lee et al.
patent: 2008/0079121 (2008-04-01), Han
patent: 2008/0113505 (2008-05-01), Sparks et al.

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