Semiconductor package and method for producing the same

Details Semiconductor package and method for producing the same Semiconductor package and method for producing the same

2011-08-23

2011-08-23

Huynh, Andy (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S108000, C257S618000, C257S712000, C257SE21499, C257SE23010

Reexamination Certificate

active

08003448

ABSTRACT:
A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.

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Wolf et al, Silicon Processing for the VLSI Era vol. 1—Process Technology, 2000, Lattice Press, pp. 858, 860, and 861.

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