Semiconductor package and method for producing the same

Details Semiconductor package and method for producing the same Semiconductor package and method for producing the same

2007-04-23

2010-10-19

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S706000, C438S110000, C438S113000

Reexamination Certificate

active

07816235

ABSTRACT:
A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.

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