4. Metal fusion bonding
  5. Process
  6. Plural joints

Joseph K. Fauty

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Electronic component and method of manufacture

Metal fusion bonding – Process – Plural joints
Patent

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Encapsulated chip scale package having flip-chip on lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Encapsulated chip scale package having flip-chip on lead...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of forming a leaded molded array package

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Beam lead formation
Reexamination Certificate

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Method of forming a molded array package device having an...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1150951

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