Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-10-05
2009-10-13
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S731000, C257S732000, C257SE23116, C257SE23129, C438S111000, C438S123000, C438S124000
Reexamination Certificate
active
07602054
ABSTRACT:
In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.
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Application Note, AN1902/D, Rev. 2, Mar. 2002, Quad Flat Pack No-Lead (QFN), ‘digital dna’, Freescale semiconductor, Inc.
Fauty Joseph K.
Kime Kent L.
Letterman, Jr. James P.
Gumedzoe Peniel M
Jackson Kevin B.
Lee Eugene
Semiconductor Components Industries L.L.C.
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