Method of forming a leaded molded array package

Details Method of forming a leaded molded array package Method of forming a leaded molded array package

2009-08-04

2010-10-26

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Beam lead formation

C257S676000

Reexamination Certificate

active

07820528

ABSTRACT:
In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead cavities, and encapsulating the lead frame assembly to form a molded array assembly. The molded array assembly is then separated into individual leaded molded packages.

REFERENCES:
patent: 7588999 (2009-09-01), Burghout et al.
patent: 7602054 (2009-10-01), Letterman et al.

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