4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

Joseph Daniel Mis

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Key-shaped solder bumps and under bump metallurgy

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods for forming an intermetallic region between a solder bum

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods for forming integrated redistribution routing...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Solder bump fabrication methods and structure including a titani

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Solder bump fabrication methods and structures including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Joseph Daniel Mis does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Joseph Daniel Mis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Joseph Daniel Mis will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-431954

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure