Methods for forming an intermetallic region between a solder bum

Details Methods for forming an intermetallic region between a solder bum Methods for forming an intermetallic region between a solder bum

1996-11-21

1999-05-11

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

148528, 22818022, 228232, 228254, B32B15/00

Patent

active

059026863

ABSTRACT:
Method for forming a solder bump on a substrate include the steps of forming an under bump metallurgy layer on a substrate, forming a solder bump on the under bump metallurgy layer, and forming an intermetallic portion of the under bump metallurgy layer adjacent the solder bump. In particular, the solder bump has a predetermined shape and this predetermined shape is retained while forming the intermetallic portion of the under bump metallurgy layer. This predetermined shape preferably has a flat surface opposite the substrate thus providing a uniform thickness of solder during the formation of the intermetallic portion. Related structures are also disclosed.

REFERENCES:
patent: 3887760 (1975-06-01), Krieger et al.
patent: 4921157 (1990-05-01), Dishon et al.
patent: 4950623 (1990-08-01), Dishon
patent: 5048744 (1991-09-01), Chang et al.
patent: 5152451 (1992-10-01), Darveaux et al.
patent: 5160409 (1992-11-01), Moore et al.
patent: 5162257 (1992-11-01), Yung
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5293006 (1994-03-01), Yung
patent: 5327013 (1994-07-01), Moore et al.
patent: 5407121 (1995-04-01), Koopman et al.
patent: 5415944 (1995-05-01), Kazem-Goudarzi et al.
patent: 5470787 (1995-11-01), Greer
patent: 5499754 (1996-03-01), Bobbio et al.
patent: 5617989 (1997-04-01), Kelzer
patent: 5629564 (1997-05-01), Nye, III et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5767010 (1998-06-01), Mis et al.
PCT Search Report; PCT/US 97/18157; International filing date: Sep. 30, 1997.
Assembly Technology In China, Electronic Packaging & Production, A Cahners Publication, vol. 35, No. 1, Jan. 1995, pp. 40 and 42.

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