4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With heat sink means

John McKenna Brennan

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Methods and apparatus for wire bonding with wire length...

Metal working – Method of mechanical manufacture – Electrical device making
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Methods and apparatus for wire bonding with wire length...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Methods and apparatus for wire bonding with wire length...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Semiconductor packaging techniques for use with non-ceramic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Techniques for reducing bowing in power transistor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Profile ID: LFUS-PAI-P-2949954

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