Methods and apparatus for wire bonding with wire length...

Details Methods and apparatus for wire bonding with wire length... Methods and apparatus for wire bonding with wire length...

2008-07-11

2009-12-29

Silverman, Stanley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S103000

Reexamination Certificate

active

07637414

ABSTRACT:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

REFERENCES:
patent: 5205463 (1993-04-01), Holdgrafer et al.
V. Solberg, “Adapting Fine-Line Flex Circuits for 3D Multiple Die Packaging,” Semiconductor Manufacturing, pp. 94-108, Jun. 2003.

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