Methods and apparatus for wire bonding with wire length...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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C257S723000, C257S724000

Reexamination Certificate

active

07443042

ABSTRACT:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4445633 (1984-05-01), Bonham, Jr.
patent: 4932584 (1990-06-01), Yamazaki et al.
patent: 5111989 (1992-05-01), Holdgrafer et al.
patent: 5156323 (1992-10-01), Kumazawa et al.
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 6010057 (2000-01-01), Egger et al.
patent: 6119926 (2000-09-01), Egger et al.
patent: 6372625 (2002-04-01), Shigeno et al.
patent: 6467678 (2002-10-01), Mochida et al.
patent: 6640436 (2003-11-01), Kimura et al.
patent: 6803665 (2004-10-01), Megahed et al.
patent: 6854637 (2005-02-01), Harun et al.
patent: 6933223 (2005-08-01), Soon et al.
patent: 2001/0017411 (2001-08-01), Terui
patent: 2003/0042622 (2003-03-01), Horibe
patent: 2003/0049882 (2003-03-01), Yin et al.
patent: 2005/0094865 (2005-05-01), Cheng et al.
V. Solberg, “Adapting Fine-Line Flex Circuits for 3D Multiple Die Packaging,” Semiconductor Manufacturing, pp. 94-108, Jun. 2003.

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