Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-08-08
2006-08-08
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S842000, C029S850000, C228S004500, C228S179100, C228S180500
Reexamination Certificate
active
07086148
ABSTRACT:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
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Bambridge Timothy Brooks
Bowen John Wayne
Brennan John McKenna
Freund Joseph Michael
Agere Systems Inc.
Arbes Carl J.
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