Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Inventor
active
Encapsulate resin LOC package and method of fabrication
Flexible pin location integrated circuit package
Integrated circuit package
Integrated circuit package and flat plate molding process...
Method for adhering and sealing a silicon chip in an integrated
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Profile ID: LFUS-PAI-P-92487