Flexible pin location integrated circuit package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

257691, 257738, 257693, H01L 2302

Patent

active

059526114

ABSTRACT:
An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.

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