4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Jean Wang

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Adjustable electrodes and coils for plasma density...

Electric heating – Metal heating – By arc
Reexamination Certificate

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Method to implement stress free polishing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Prediction of uniformity of a wafer

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate

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PVD target with end of service life detection capability

Metal fusion bonding – Process – With shaping
Reexamination Certificate

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Stacked structures and methods of fabricating stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2162570

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