Prediction of uniformity of a wafer

Details Prediction of uniformity of a wafer Prediction of uniformity of a wafer

2007-05-03

2009-12-15

Bahta, Kidest (Department: 2123)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S303000, C438S014000, C716S030000

Reexamination Certificate

active

07634325

ABSTRACT:
A method of monitoring uniformity of a wafer is provided. A wafer parameter is selected. Manufacturing data is collected. The manufacturing data includes measurements of the selected wafer parameter. An average offset profile of the wafer parameter for a first and second wafer is determined using the manufacturing data. The first and second wafer are associated with a product type and were processed by a processing tool. An offset profile for a third wafer is predicted for a wafer using the average offset profile. The third wafer is associated with the product type and was processed by the processing tool.

REFERENCES:
patent: 4493745 (1985-01-01), Chen et al.
patent: 5402367 (1995-03-01), Sullivan et al.
patent: 5503707 (1996-04-01), Maung et al.
patent: 5838595 (1998-11-01), Sullivan et al.
patent: 6211094 (2001-04-01), Jun et al.
patent: 6254457 (2001-07-01), Perrin et al.
patent: 6582976 (2003-06-01), Watanabe
patent: 6623333 (2003-09-01), Patel et al.
patent: 6645781 (2003-11-01), Jiang et al.
patent: 6917849 (2005-07-01), Pasadyn et al.
patent: 6961626 (2005-11-01), Paik
patent: 7144297 (2006-12-01), Lin et al.
patent: 2008/0032426 (2008-02-01), Michaelson et al.
patent: 0445640 (1991-09-01), None
patent: 0643344 (1993-07-01), None
Ling, Zhi-min et al., “In-Line Supervisory Control In A Photolithographic Workcell”, Advanced Techniques for Integrated Circuit Processing, 1990, pp. 660-669, SPIE vol. 1392.
Dishon, G. et al., “Monitoring Choices Of CMP Planarization Processes”, CMP-MIC Conference, Feb. 1997, pp. 391-398.

Affiliated with

Also associated with

Rating

Prediction of uniformity of a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Prediction of uniformity of a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Prediction of uniformity of a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4133762