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James K. Lake
James K.
Lake
Alloys or metallic compositions
Containing over 50 per cent metal but no base metal
Copper containing
Inventor
active
Affiliated with
High temperature, lead-free, tin based solder composition
Alloys or metallic compositions – Tin base – Copper containing
Patent
[ 0.00 ] – not rated yet
Lead free, tin-bismuth solder alloys
Alloys or metallic compositions – Containing over 50 per cent metal but no base metal – Copper containing
Patent
[ 0.00 ] – not rated yet
Lead-free, high temperature, tin based multi-component solder
Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
Patent
[ 0.00 ] – not rated yet
Lead-free, high tin, ternary solder alloy of tin, bismuth, and i
Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
Patent
[ 0.00 ] – not rated yet
Lead-free, high tin, ternary solder alloy of tin, bismuth, and i
Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
[ 0.00 ] – not rated yet
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Profile ID: LFUS-PAI-P-161979
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