4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Jagdish G. Belani

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Integrated circuit package assemblies including an electrostatic

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Polymeric insulation layer etching process and composition

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Solder composition for thin coatings

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Thermal ball lead integrated package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Ultra thin ball grid array using a flex tape or printed wiring b

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Profile ID: LFUS-PAI-P-578546

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