Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1983-06-27
1984-12-04
O'Keefe, Veronica
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428643, 75 05R, 357 67, H02B 104, H05K 328
Patent
active
044865112
ABSTRACT:
A solder composition of 10 to 40 percent tin, with the balance lead, for use in thin layers of 50 to 500 microinches on copper integrated circuit leads so as to resist the formation of intermetallics when later heated.
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patent: 3761309 (1973-09-01), Schmitter et al.
patent: 4097266 (1978-06-01), Takahashi et al.
patent: 4273859 (1981-06-01), Mones et al.
Metals Handbook 9th Ed., vol. 2, Prop. and Selections: Nonferrous Alloys and Pure Metals, Am. So. Metals, Metals Park, Ohio, pp. 620-621, 1981.
Belani Jagdish G.
Chen Yung-Shih
Sajja Vijay
National Semiconductor Corporation
O'Keefe Veronica
Pollock Michael J.
Winters Paul J.
Woodward Gail W.
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