Integrated circuit package assemblies including an electrostatic

Details Integrated circuit package assemblies including an electrostatic Integrated circuit package assemblies including an electrostatic

1996-03-01

1997-07-01

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257676, 257672, 257203, H01L 2362, H01L 2352, H01L 25065

Patent

active

056441673

ABSTRACT:
An integrated circuit package assembly incorporating an electrostatic discharge (ESD) interposer is disclosed. The assembly includes a semiconductor chip including a plurality of chip input/output terminals. The interposer is formed using a substrate which supports the chip and includes an arrangement having a plurality of integrally formed ESD protection circuits for providing ESD protection to predetermined ones of the chip input/output terminals.

REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 5486720 (1996-01-01), Kierse
patent: 5495118 (1996-02-01), Kinoshita et al.
patent: 5545909 (1996-08-01), Williams et al.
patent: 5545912 (1996-08-01), Ristic et al.

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