Ultra thin ball grid array using a flex tape or printed wiring b

Details Ultra thin ball grid array using a flex tape or printed wiring b Ultra thin ball grid array using a flex tape or printed wiring b

1995-05-11

1997-04-15

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438126, 438124, 29841, 29855, H01L 2160

Patent

active

056209282

ABSTRACT:
A method of manufacturing an integrated circuit package assembly including (i) an integrated circuit die having a bottom surface and a plurality of input/output terminals, (ii) electrically conductive traces and/or contacts accessible from outside the assembly, and (iii) an encapsulating material encapsulating the integrated circuit die and portions of the electrically conductive traces and/or contacts will be disclosed. The method includes the following steps. First, a temporary support substrate or carrier having a top surface is provided for supporting the integrated circuit package as the package is being assembled. Then, the integrated circuit die is detachably supported on the top surface of the temporary support substrate. Each of the input/output terminals on the integrated circuit die are electrically connected to the electrically conductive traces and/or contacts. Next, the integrated circuit die and at least a portion of the electrically conductive traces and/or contacts are encapsulated with the encapsulating material such that the bottom surface of the integrated circuit die supported by the temporary support substrate is not covered by the encapsulating material. Finally, the encapsulated integrated circuit die is detached from the temporary support substrate.

REFERENCES:
patent: 5102829 (1992-04-01), Cohn
patent: 5292688 (1994-03-01), Hsiao et al.
patent: 5340771 (1994-08-01), Rostoker
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5490324 (1996-02-01), Newman

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