4. Fishing, trapping, and vermin destroying

Israel A. Lesk

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Backside processing method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent

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Bipolar semiconductor device having a conductive recombination l

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Conductive diffusion barrier of titanium nitride in ohmic contac

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Die corner design having topological configurations

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Field plate avalanche diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Profile ID: LFUS-PAI-P-97948

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