Die corner design having topological configurations

Details Die corner design having topological configurations Die corner design having topological configurations

1988-02-22

1990-05-22

James, Andrew J.

357 70, 357 52, 357 68, H01L 2328

Patent

active

049281623

ABSTRACT:
An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.

REFERENCES:
patent: 4625227 (1986-11-01), Hara et al.

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