Error detection/correction and fault detection/recovery
Pulse or data error handling
Memory testing
Corporate Assignee
active
No affiliations
Architecture and method for testing of an integrated circuit...
Bonding pads for testing of a semiconductor device
Bonding pads for testing of a semiconductor device
Chip testing within a multi-chip semiconductor package
Chip testing within a multi-chip semiconductor package
LandOfFree
Inapac Technology, Inc. does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Inapac Technology, Inc., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inapac Technology, Inc. will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2398176