Bonding pads for testing of a semiconductor device

Details Bonding pads for testing of a semiconductor device Bonding pads for testing of a semiconductor device

2007-08-21

2007-08-21

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S763010, C324S1540PB, C365S201000

Reexamination Certificate

active

11108385

ABSTRACT:
In one embodiment, a first integrated circuit (IC) chip may comprise one or more bonding pads to which bonding wires from respective external leads may be connected. Other bonding wires connect the same bonding pads on the first IC chip to a second IC chip. This can be used, for example, to reduce the need for connections integral to the first IC chip for routing the signals received over the bonding wires internally in the first IC chip to the second IC chip.

REFERENCES:
patent: 4263650 (1981-04-01), Bennett et al.
patent: 4743841 (1988-05-01), Takeuchi
patent: 4773028 (1988-09-01), Tallman
patent: 4825414 (1989-04-01), Kawata
patent: 4873669 (1989-10-01), Furutani et al.
patent: 5151881 (1992-09-01), Kajigaya et al.
patent: 5251095 (1993-10-01), Miller et al.
patent: 5301156 (1994-04-01), Talley
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5388104 (1995-02-01), Shirotori et al.
patent: 5418452 (1995-05-01), Pyle
patent: 5457400 (1995-10-01), Ahmad et al.
patent: 5477545 (1995-12-01), Huang
patent: 5479105 (1995-12-01), Kim et al.
patent: 5506499 (1996-04-01), Puar
patent: 5523697 (1996-06-01), Farnworth et al.
patent: 5535165 (1996-07-01), Davis et al.
patent: 5594694 (1997-01-01), Roohparvar et al.
patent: 5604432 (1997-02-01), Moore et al.
patent: 5619461 (1997-04-01), Roohparvar
patent: 5657284 (1997-08-01), Beffa
patent: 5677885 (1997-10-01), Roohparvar
patent: 5719438 (1998-02-01), Beilstein et al.
patent: 5751015 (1998-05-01), Corbett et al.
patent: 5751987 (1998-05-01), Mahant-Shetti et al.
patent: 5801452 (1998-09-01), Farnworth et al.
patent: 5805609 (1998-09-01), Mote, Jr.
patent: 5807762 (1998-09-01), Akram et al.
patent: 5825697 (1998-10-01), Gilliam et al.
patent: 5825782 (1998-10-01), Roohparvar
patent: 5923600 (1999-07-01), Momohara
patent: 5925142 (1999-07-01), Raad et al.
patent: 5936260 (1999-08-01), Corbett et al.
patent: 5959310 (1999-09-01), Akram et al.
patent: 5966388 (1999-10-01), Wright et al.
patent: 5995379 (1999-11-01), Kyougoku et al.
patent: 6011720 (2000-01-01), Tanaka
patent: 6026039 (2000-02-01), Kim et al.
patent: 6047393 (2000-04-01), Yamada
patent: 6069483 (2000-05-01), Maxwell et al.
patent: 6072326 (2000-06-01), Akram et al.
patent: 6087676 (2000-07-01), Akram et al.
patent: 6100708 (2000-08-01), Mizuta
patent: 6100716 (2000-08-01), Adham et al.
patent: 6104658 (2000-08-01), Lu
patent: 6137167 (2000-10-01), Ahn et al.
patent: 6154860 (2000-11-01), Wright et al.
patent: 6157046 (2000-12-01), Corbett et al.
patent: 6188232 (2001-02-01), Akram et al.
patent: 6191603 (2001-02-01), Muradali et al.
patent: 6194738 (2001-02-01), Debenham et al.
patent: 6208157 (2001-03-01), Akram et al.
patent: 6216241 (2001-04-01), Fenstermaker et al.
patent: 6243839 (2001-06-01), Rooparvar
patent: 6243840 (2001-06-01), Raad et al.
patent: 6263463 (2001-07-01), Hashimoto
patent: 6274937 (2001-08-01), Ahn et al.
patent: 6286115 (2001-09-01), Stubbs
patent: 6294839 (2001-09-01), Mess et al.
patent: 6298001 (2001-10-01), Lee et al.
patent: 6300782 (2001-10-01), Hembree et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6320201 (2001-11-01), Corbett et al.
patent: RE37611 (2002-03-01), Roohparvar
patent: 6365421 (2002-04-01), Debenham et al.
patent: 6366487 (2002-04-01), Yeom
patent: 6392948 (2002-05-01), Lee
patent: 6395565 (2002-05-01), Akram et al.
patent: 6396291 (2002-05-01), Akram et al.
patent: 6407566 (2002-06-01), Brunelle et al.
patent: 6441479 (2002-08-01), Ahn et al.
patent: 6445625 (2002-09-01), Abedifard
patent: 6456099 (2002-09-01), Eldridge et al.
patent: 6470484 (2002-10-01), Day et al.
patent: 6472747 (2002-10-01), Bazarjani et al.
patent: 6483760 (2002-11-01), Kang
patent: 6484279 (2002-11-01), Akram
patent: 6502215 (2002-12-01), Raad et al.
patent: 6507885 (2003-01-01), Lakhani et al.
patent: 6519171 (2003-02-01), Matsuzaki et al.
patent: 6519725 (2003-02-01), Huisman et al.
patent: 6732304 (2004-05-01), Ong
patent: 6791175 (2004-09-01), Matsuo et al.
patent: 6801461 (2004-10-01), Hii et al.
patent: 6996754 (2006-02-01), Lee
patent: 2002/0117729 (2002-08-01), Aiki et al.
patent: 2004/0232559 (2004-11-01), Adelmann

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